Our materials
DOTEC®
Depending on the material selection, our DOTEC material series offers the following properties:
Good mechanical strength
Very good dimensional stability (quasi-isotropic materials)
Good temperature stability
Low heat conductivity
Good electrically-insulating property
Chemical resistance
Suitable for clean rooms (glass-bound mica material)
To find the right material for your requirement, we start by clarifying the operating conditions. This provides a basis from which we can suggest a suitable material for your application.
| Application temperature (°C) |
Compressive strength (N/mm2) |
Flexural strength (N/mm2) |
Thermal conductivity (W/mK) |
Linear thermal expansion coefficient (10-6 1/K) |
Electrical dielectric strength (KV/3mm) |
Creepage current resistance |
Arc |
||
| Permanent | Short term | at 23°C | at 23°C | ||||||
| DOTHERM® 700 | 700 | 700 | 120 | 32 | 0.37 | 6 | 8.7 | - | > 370 |
| DOTHERM® 1000 | 1000 | 1000 | 35 | 18 | 0.50 | 6.4 | 14.1 | CTI 600 | > 420 |
| DOTHERM® 1100 | 1100 | 1100 | 16 | 7 | 0.1 | 7 | - | - | - |
| DOTHERM® 600 M | 600 | 600 | 400 | 230 | 0.26 | 10 | 75 | CTI 500 | > 420 |
| DOTHERM® 800 M | 800 | 800 | 330 | 170 | 0.26 | 10 | 75 | CTI 525 | > 420 |
| DOTEC® 200 | 200 | 220 | 330 | 100 | 0.3 | 13 | - | - | - |
| DOTEC® 280 | 280 | 300 | 150 | 30 | 0.28 | 20 | - | - | - |
| DOTEC® 350 | 350 | 400 | 38 | 20 | 0.12 | 40 | 20 | - | - |
| DOTEC® 500 M | 500 | 500 | 310 | 85 | 0.87 | 11 | 86.1 | CTI 600 | > 245 |
| DOTEC® 600 | 600 | 600 | 220 | 76 | 1.32 | 10 | 49.5 | CTI 600 | > 345 |
| DOFLEX® MSP | 700 | 1000 | - | - | 0.2 | - | 60 | - | - |
| DOFLEX® CM 30 | 1000 | 1100 | - | - | 0.1 | - | 69 | - | - |
The values listed were determined on standard test specimens. The material properties may deviate from these values depending on the applications and component geometry. Please contact us for precise clarification of the material suitability. Other technical data on request. Subject to technical modifications and errors. 2014 edition.
Sample Solutions
Gripper fingers
Gripper fingers have component-specific contours at their ends that enable them to pick up, grip, transport or guide components. They are used primarily in electronics manufacturing.
Vacuum-tight components
Many technical processes such as semiconductor fabrication, medical technology or material testing are conducted in a vacuum.
Goods carriers
Goods carriers are used to hold other products, such as circuit boards. In many cases, they must be electrically insulating, wear-resistant and designed to cope with thermal shock to enable smooth handling.
Heat insulation board
DOTHERM and ISOCOS offer heat protection plates that are precisely adapted to the respective process requirements in terms of material, compression strength, temperature resistance and dimensional stability.
Non-material-specific insulation solutions
In many industrial applications, it makes sense to use multi-layered materials or material combinations.